via and double-sided pad

This commit is contained in:
Bane Stojkovic
2026-11-12 10:48:19 +01:00
parent d166c58161
commit 3049d4910c
11 changed files with 465 additions and 16 deletions
+39 -1
View File
@@ -1691,7 +1691,7 @@
"namePrefix" : "Pad",
"description" : "Copper solder pad, round or square",
"creationMethod" : "SINGLE_CLICK",
"notes" : [ "Use on Blank Board and PCB layouts; Perf Board, Vero Board, TriPad Board and the proto boards already have their own pads" ],
"notes" : [ "Use on Blank Board and PCB layouts; Perf Board, Vero Board, TriPad Board and the proto boards already have their own pads; a pad with Hole Type 'Plated Through Hole' is on both copper layers and joins them, so its Layer is ignored" ],
"properties" : [ {
"name" : "Alpha",
"type" : "Percentage",
@@ -1931,6 +1931,44 @@
} ]
} ]
}
}, {
"name" : "Via",
"className" : "connectivity.Via",
"category" : "Connectivity",
"namePrefix" : "Via",
"description" : "Plated hole joining the copper on the top and bottom of a PCB",
"creationMethod" : "SINGLE_CLICK",
"notes" : [ "Use on Blank Board and PCB layouts to take a trace from one copper layer to the other", "Place the control point where a Top trace and a Bottom trace meet; the via joins the copper of both layers there. It is not a component pad: leads go into a Solder Pad" ],
"properties" : [ {
"name" : "Alpha",
"type" : "Percentage",
"format" : "number without the % sign, e.g. 100",
"defaultValue" : "100"
}, {
"name" : "Color",
"type" : "Color",
"format" : "hex",
"defaultValue" : "#000000"
}, {
"name" : "Hole",
"type" : "Size",
"format" : "(value)(unit)",
"possibleUnits" : [ "px", "mm", "cm", "m", "in", "ft", "yd" ],
"defaultValue" : "0.4mm"
}, {
"name" : "Name",
"type" : "String"
}, {
"name" : "Size",
"type" : "Size",
"format" : "(value)(unit)",
"possibleUnits" : [ "px", "mm", "cm", "m", "in", "ft", "yd" ],
"defaultValue" : "0.8mm"
} ],
"pinout" : {
"pinCount" : 1,
"labels" : "sequential"
}
}, {
"name" : "Arduino Mega 2560",
"className" : "micro.ArduinoMega",