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Solder pads can be sent behind copper traces to allow creating white

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border around traces on top of a ground plane
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bancika
2017-04-12 17:09:12 +02:00
parent aadeac3f34
commit 8e6f7a07e5
4 changed files with 10 additions and 3 deletions
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diylc/diylc-swing/update.xml
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@@ -1653,6 +1653,10 @@
<org.diylc.appframework.update.Change>
<changeType>IMPROVEMENT</changeType>
<description>Hookup wire can be sent to back behind boards</description>
</org.diylc.appframework.update.Change>
<org.diylc.appframework.update.Change>
<changeType>IMPROVEMENT</changeType>
<description>Solder pads can be sent behind copper traces to allow creating white border around traces on top of a ground plane</description>
</org.diylc.appframework.update.Change>
</changes>
<url>https://github.com/bancika/diy-layout-creator/releases</url>