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Update update.xml
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@@ -249,6 +249,10 @@
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<releaseDate>2025-03-09 00:00:00.000 CET</releaseDate>
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<name></name>
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<changes>
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<org.diylc.appframework.update.Change>
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<changeType>NEW_FEATURE</changeType>
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<description>Added ability to render the underside of boards along with the top side for easier validation, building and debugging</description>
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</org.diylc.appframework.update.Change>
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<org.diylc.appframework.update.Change>
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<changeType>NEW_FEATURE</changeType>
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<description>Configurable 'High DPI Rendering' feature which makes the diagram smoother on high-resolution displays but can affect performance</description>
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